IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
€186.00
IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
€244.00
IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
€133.00
IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
€23.00
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad; cyanate ester non-woven aramid laminate of defined flammability, copper clad (IEC 61249-2-13:1999); German version EN 61249-2-13:1999
€84.58
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad; epoxide non-woven aramid laminate of defined flammability, copper-clad (IEC 61249-2-12:1999); German version EN 61249-2-12:1999
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001.
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998
€105.42
Printed board assemblies - Part 1: Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:1998); German version EN 61191-1:1998.
€111.40
Printed board assemblies - Part 2: Sectional specification: Requirements for surface mount soldered assemblies (IEC 61191-2:1998); German version EN 61191-2:1998.
€98.32
Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998); German version EN 61191-3:1998.
€77.20
Printed board assemblies - Part 4: Sectional specification: Requirements for terminal soldered assemblies (IEC 61191-4:1998); German version EN 61191-4:1998.
€63.27
IEC 60050-541:1990 International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
€93.00
IEC 60326-2:1990 Printed boards. Part 2: Test methods
€441.00
