31.180 : Printed circuits and boards

IEC 60326-2:1990/AMD1:1992

IEC 60326-2:1990/AMD1:1992

Withdrawn Most Recent

IEC 60326-2:1990/AMD1:1992 Amendment 1 - Printed boards. Part 2: Test methods

€12.00

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IEC 61249-5-1:1995

IEC 61249-5-1:1995

Active Most Recent

IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

€133.00

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IEC 61249-7-1:1995

IEC 61249-7-1:1995

Active Most Recent

IEC 61249-7-1:1995 Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

€23.00

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IEC 61249-8-7:1996

IEC 61249-8-7:1996

Active Most Recent

IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

€93.00

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IEC 62326-4:1996

IEC 62326-4:1996

Active Most Recent

IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

€302.00

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IEC 62326-4-1:1996

IEC 62326-4-1:1996

Active Most Recent

IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

€441.00

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IEC 61189-1:1997

IEC 61189-1:1997

Active Most Recent

IEC 61189-1:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

€133.00

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IEC 61249-8-8:1997

IEC 61249-8-8:1997

Active Most Recent

IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

€46.00

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IEC 61188-1-1:1997

IEC 61188-1-1:1997

Withdrawn Most Recent

IEC 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

€46.00

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IEC 61189-1:1997/AMD1:2001

IEC 61189-1:1997/AMD1:2001

Active Most Recent

IEC 61189-1:1997/AMD1:2001 Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

€23.00

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IEC 61249-2-19:2001

IEC 61249-2-19:2001

Withdrawn Most Recent

IEC 61249-2-19:2001 Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad

€133.00

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IEC 61249-2-4:2001

IEC 61249-2-4:2001

Active Most Recent

IEC 61249-2-4:2001 Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

€133.00

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IEC 61249-2-18:2002

IEC 61249-2-18:2002

Withdrawn Most Recent

IEC 61249-2-18:2002 Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

€186.00

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IEC 61249-2-7:2002

IEC 61249-2-7:2002

Active Most Recent

IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

€186.00

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IEC 62326-1:2002

IEC 62326-1:2002

Active Most Recent

IEC 62326-1:2002 Printed boards - Part 1: Generic specification

€389.00

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