Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002
€98.32
Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad; Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad (IEC 61249-2-19:2001); German version EN 61249-2-19:2002
€91.03
Materials for printed boards and other for interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad; Polyester non-wowen/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 61249-2-4:2001); German version EN 61249-2-4:2002
Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials clad and unclad; Polyester non-woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad (IEC 61249-2-18:2002); German version EN 61249-2-18:2002
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999
€84.58
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyimide film (IEC 61249-3-4:1999); German version EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyester film (IEC 61249-3-3:1999); German version EN 61249-3-3:1999
Device embedded substrate - Generic specification (IEC 91/1509/CD:2018); Text in German and English
€105.42
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English
€145.14
An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
€77.00
Printed electronics - Materials - Part 1: Substrates (IEC 119/48/CD:2014)
€150.65
Printed electronics - Materials - Part 2-1: Conductive Material Ink (IEC 119/49A/CD:2014)
€122.34
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 91/1215/CD:2014)
Space product assurance - Qualification of printed circuit boards; English version EN 16602-70-10:2015
€195.79
Space product assurance - Procurement of printed circuit boards; English version EN 16602-70-11:2015
€128.22
