MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
€60.00
Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings.
€59.00
Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
€62.00
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality.
€35.00
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade.
€47.00
Materials for printed boards and other interconnecting structures -- Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad.
€69.00
Materials for printed boards and other interconnecting structures -- Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad.
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).
€40.00
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test).
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards.
Base materials for printed circuits -- Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards.
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality
