IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
€46.00
IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
€93.00
IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
€133.00
IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
€186.00
IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
€23.00
IEC 61189-2-804:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
IEC 61189-2-720:2024 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-8:2003); German version EN 61249-2-8:2003
€98.32
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-9:2003); German version EN 61249-2-9:2003
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-10:2003); German version EN 61249-2-10:2003
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 91/950/CD:2010)
€84.58
