Materials for printed boards and other interconnecting structures -- Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
€74.00
Materials for printed boards and other interconnecting structures -- Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
€0.00
Materials for printed boards and other interconnecting structures -- Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures -- Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures -- Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Printed board and printed board assemblies. Design and use. Part 1-1 : generic requirements. Flatness considerations for electronic assemblies. - Cartes imprimées et cartes imprimées équipées
€85.42
Printed boards. Part 4 : rigid multilayer printed boards with interlayer connections. Sectional specification. - Cartes imprimées
€123.39
Connectors for frequencies below 3 MHz for use with printed boards. Part 2 : detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0.1 in) with common mounting features.
€154.83
Connectors for frequencies below 3 MHz for use with printed boards. . Part 12 : detail specification for dimensions, general requirements and tests for à range of socket designed for use with integrated circuits.
€111.67
Materials for interconnection structures. Part 8 : sectional specification set for non-conductive films and coatings. . Section 8 : temporary polymer coatings. - Matériaux pour les structures d'interconnexion
€77.67
Connectors for frequencies below 3 MHz for use with printed boards. . Part 13 : detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in) , with free connectors for non accessible insulation displacement terminations (ID).
€138.00
Printed boards - Part 1 : generic specification
€98.42
Materials for interconnection structures. Part 5 : sectional specification set for conductive foils and films with or without coatings. Section 4 : conductive inks.
€95.67
Electronic components. Inspection of printed boards for microwave applications. - Composants électroniques - Cartes imprimées
Test methods for electrical materials, interconnection structures and assemblies. Part 1 : general test methods and methodology.
€87.39
