Test methods for electrical materials, printed boards and other interconnection structures assemblies Measurement of melting temperature or ranges solder alloys
€193.00
Printed boards Device embedded substrate. Terminology / reliability design guide
€374.00
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
€269.00
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance epoxide non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed fabrication
€355.00
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad. Multifunctional expoxide woven E-glass prepeg of defined flammability
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Printed boards and assemblies. Design use. Attachment (land/joint) considerations considerations. Generic requirements
€404.00
Specification for finished fabric woven from “E” glass for printed boards
