Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
€269.00
Printed electronics Materials. Conductive ink. patterns for mechanical test
€193.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Measurement of resilience strength retention factor flexible dielectric
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Decomposition temperature (Td) using TGA
€165.00
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
BS EN IEC 63203-401-1. Wearable electronic devices and technologies Part 401-1. Devices Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor
€23.00
Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of
BS IEC 62899-506-1. Printed electronics Part 506-1. Quality assessment- Accelerated stress test of printed heating element
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Printed board assemblies Technical cleanliness of components and printed
€404.00
BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
