BS EN 62899-401. Printed electronics Part 401. Printability. Overview
€23.00
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
BS EN IEC 63203-402-2. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
BS IEC 62899-203-2 Printed electronics Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
Test methods for electrical materials, circuit boards and other interconnection structures assemblies Detection of defects in by measurement capacitance
€193.00
Printed board assemblies Application and utilization of protective coatings for electronic
€404.00
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit for use in automotive applications. Best practices
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
€165.00
BS IEC 63240-1. Active assisted living (AAL) reference architecture and model Part 1. Reference
BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. parameters of physically contacting 50 µm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row 12, 8, 4, or 2 fibres reference connector applications
BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 µm core diameter fibres. Non-angled 2,5 mm 1,25 cylindrical full zirconia ferrules reference connection applications
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
Format for LSI-Package-Board Interoperable design
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation printed
Test methods for electrical materials, printed boards and other interconnection structures assemblies Thermal conductivity test base materials
