31.180 : Printed circuits and boards

BS EN IEC 63203-801-1:2022

BS EN IEC 63203-801-1:2022

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Wearable electronic devices and technologies Smart body area network (SmartBAN). Enhanced ultra-low power physical layer

€193.00

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PD IEC TR 62878-2-8:2021

PD IEC TR 62878-2-8:2021

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Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate

€193.00

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20/30419960 DC:2020

20/30419960 DC:2020

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BS EN IEC 61189-2-805. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-805. X/Y CTE Thin Base Materials by TMA

€23.00

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PD IEC TR 61191-8:2021

PD IEC TR 61191-8:2021

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Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices

€316.00

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BS EN IEC 61189-2-808:2024

BS EN IEC 61189-2-808:2024

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Test methods for electrical materials, printed board and other interconnection structures assemblies Thermal resistance of an assembly by thermal transient method

€269.00

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BS IEC 62899-202:2023

BS IEC 62899-202:2023

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Printed electronics Materials. Conductive ink

€316.00

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BS EN IEC 61189-2-805:2024

BS EN IEC 61189-2-805:2024

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Test methods for electrical materials, printed boards and other interconnection structures assemblies X/Y CTE test thin base materials by TMA

€165.00

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21/30432230 DC:2021

21/30432230 DC:2021

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BS EN IEC 63203-402-3. Wearable electronic devices and technologies Part 402-3. Performance measurement method of wearables. Series 2: Accuracy Heart Rate Determination

€23.00

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PD IEC TR 62878-2-9:2022

PD IEC TR 62878-2-9:2022

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Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries

€193.00

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BS IEC 62899-202-8:2024

BS IEC 62899-202-8:2024

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Printed electronics Materials. Conductive ink. Measurement of difference in resistance printing direction conductive film fabricated with wire-shaped materials

€193.00

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23/30436874 DC:2023

23/30436874 DC:2023

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BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

€23.00

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BS IEC 62899-202-10:2023

BS IEC 62899-202-10:2023

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Printed electronics Materials. Resistance measurement method for thermoformable conducting layer

€269.00

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24/30477141 DC:2024

24/30477141 DC:2024

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BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test

€23.00

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21/30441791 DC:2021

21/30441791 DC:2021

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BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-809. X/Y Coefficient of Thermal Expansion (CTE) Thick Base Materials by TMA

€23.00

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BS EN IEC 61249-2-51:2023

BS EN IEC 61249-2-51:2023

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Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Base materials integrated circuit card carrier tape, unclad

€193.00

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