BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
€23.00
BS EN IEC 61189-3-720 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 3-720: (circuit boards) - Transmission loss test method high frequency multilayer circuit
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)
€316.00
Test methods for electrical materials, circuit boards and other interconnection structures assemblies X/Y coefficient of thermal expansion (CTE) test thick base materials by TMA
€165.00
BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad high speed applications
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
Specification for pressboard for electrical purposes
€269.00
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
Printed electronics Printability. Overview
€193.00
Printed electronics Material technologies required in printed for wearable smart devices
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
Materials for printed boards and other interconnecting structures Part 2-52: Reinforced base materials clad unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
Draft BS EN 61189-5-501 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 5-501: General test materials - Surface insulation resistance (SIR) testing of solder fluxes
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad — PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Test methods for electrical materials, printed boards and other interconnection structures assemblies Detection of plating defects in unpopulated circuit by computed tomography (CT)
