Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
€111.67
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
€138.00
Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies
€127.67
Product package labels for electronic components using bar code and two-dimensional symbologies
€116.33
Space product assurance - High-reliability soldering for surface-mount and mixed technology
€261.00
Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices
€59.33
Printed boards and printed board assemblies - Design and use - Part 6-4 : land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4 : Exigences génériques pour les dessins dimensionnels de CMS du point de vue de la conception de la zone de report
Printed board assemblies - Part 1 : generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€149.33
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
€99.50
Electronics assembly technology - Part 4 : endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology - Part 3 : selection guidance of environmental and endurance test methods for solder joints
€153.00
IEC 60068-2-69:2017/AMD1:2019 Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
€23.00
IEC 61760-3:2021 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
€244.00
IEC 60194-1:2021 Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
€551.00
IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
€186.00
