Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method (IEC 47D/469/CDV:2001); German version prEN 60191-6-4:2001
€69.91
Draft IEC 61969-3: Outdoor enclosures - Part 3: Climatic, mechanical tests and safety aspects for cabinets and cases (IEC 48D/193/CD:1999)
€48.79
Semiconductor devices, mechanical standardization - Package outline for plastic fine pitch quad flat pack (FQFP) family, S-R.QPF XXXE (Intended for inclusion into IEC 60191-2) (IEC 47D/275/CDV:1999)
€84.58
Mechanical standardization of semiconductor devices, common package unit design guide for 1,50 mm, 1,27 mm and 1,00 mm ball-grid-terminal-packages (IEC 47D/301/CD:1999)
€41.78
Proposal for 60 and 90 Pin P-FBGA (Plastic Fine pitch Ball Grid Array) 0,8 mm (IEC 47D/316A/CD:1999)
Tape ball grid array package, 0,6 mm ball diameter family (IEC 47D/314A/CD:1999)
€128.22
Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 102E (IEC 47D/330/CDV:1999)
€63.27
Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 119E (IEC 47D/331/CDV:1999)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Standard overall package height; Amendment 1 to IEC 60191-4 (IEC 47D/362/CD:2000)
€34.30
Amendment 2 to IEC 60191-6: Mechanical standardization of semiconductor devices - Pin grid array 2,54 mm pitch outline family (Intended for inclusion into IEC 60191-2) (IEC 47D/332/CD:1999)
Semiconductor devices, mechanical standardization, 3-Leaded SMD (Body Size D x E: 2.9 x 1.5 mm) outline family 162 E (IEC 47D/440/FDIS:2001)
General design guideline for rectangular FBGA packages (IEC 47D/394/CDV:2000)
€91.03
Method of determining enclosure thermal performance by the influence of internal heat load and sun radiation (IEC 48D/262/CD:2001)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment A2 (IEC 47D/452/CDV:2001); German version EN 60191-4:1999/prA2:2001
Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) (IEC 47D/490/CD:2002)
