Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-105: Dimensions and design aspects for 1U chassis (IEC 48D/354/CD:2007)
€69.91
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 48D/355/CD:2007)
Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)
€111.40
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007); German version EN 61587-1:2007.
€105.42
Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
€128.22
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007)
€122.34
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; Interface co-ordination dimensions for the 25 mm equipment practice; Section 3: Extended detail specification; Dimensions for subracks chassis, backplanes, front panels, and plug-in units (IEC 48D/285/CD:2003)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 49/610/CDV:2003); German version prEN 61837-4:2003
Crystal enclosure; metal, soldered; pins, type G1, outlines
€41.78
Crystal enclosure; metal, soldered; wires, type N2A, outlines
Crystal enclosure; metal, welded; wires, type K4A, outlines
Mechanical standardization, proposal for an amendment to IEC publication 60191-2: notes to IEC A50, drawing IEC I-50b
Mechanical standardization, integrated circuits, revision of IEC-publication 60191-3
Mechanical standardization; additional outline drawings for inclusion in IEC-Publication 60191-2
