Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units (IEC 60297-3-101:2004); German version EN 60297-3-101:2004.
€105.42
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin (IEC 60297-3-103:2004); German version EN 60297-3-103:2004.
€91.03
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
€77.20
Sectional specification for outdoor enclosures (IEC 48D/142/CD:1997)
€41.78
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice; section 1: Detail specification; dimensions for cabinets and racks (IEC 60917-2-1:1993); German version EN 60917-2-1:1995
€56.17
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice; section 2: Detail specification; dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-2:1994); German version EN 60917-2-2:1996
€98.32
Surface acoustic wave (SAW) resonators; part 3: standard outlines and lead connections; identical with IEC 61019-3:1991
€84.58
Piezoelectric ceramic resonators; part 3: standard outlines; identical with IEC 60642-3:1992
€48.79
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011); German version EN 61837-2:2011.
€214.30
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:2012); German version EN 61837-1:2012.
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007.
€116.64
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007.
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment (IEC 60917-2-5:2012); German version EN 60917-2-5:2012
