Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
€98.32
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosure (IEC 49/1030/CD:2013)
€105.42
Surface mounted piezoelectric devices for frequency control and selection - Standard outline and terminal lead connections - Part 4: Hybrid enclosure outline (IEC 49/1031/CD:2013)
€84.58
Method of evaluating the thermal performance of enclosures (IEC 62194:2005); German version EN 62194:2005
€111.40
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
€56.17
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-3:2006); German version EN 60917-2-3:2006
€116.64
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006.
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions of subracks and plug-in units (IEC 60297-3-104:2006); German version EN 60297-3-104:2006
Emballage de composants pour opérations automatisées - Partie 3 : emballage des composants pour montage en surface en bandes continues
€184.00
Structures mécaniques pour équipement électrique et électronique - Enveloppes de plein air - Partie 1 : lignes directrices pour la conception
€95.67
Structures mécaniques pour équipement électrique et électronique - Enveloppes de plein air - Partie 3 : exigences et essais d'environnement, et aspects liés à la sécuritéAutomatic translation from French : Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: environmental requirements and testing, and safety aspects
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 48D/585A/CD:2015)
€91.03
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 49/1141/CD:2015)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 61837-4:2015); German version EN 61837-4:2015.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2015); German version EN 61837-3:2015.
