IEC 60297-3-106:2010 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
€93.00
IEC 60917-2-4:2010 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
IEC 61587-2:2011 Mechanical structures for electronic equipment - Tests for IEC 60917 and 60297 - Part 2: Seismic tests for cabinets and racks
IEC 61969-1:2011 Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines
€46.00
IEC 61969-2:2011 Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions
€23.00
IEC 61969-3:2011 Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
IEC 60297-3-107:2012 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
€302.00
IEC 60917-2-5:2012 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
€133.00
IEC 61587-4:2012 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets
IEC 61587-3:2013 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 62610-4:2013 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets
IEC 61587-5:2013 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units
€186.00
