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18/30375624 DC:2018
BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods Part 20-1. Handling, packing, labelling shipping of surface-mount devices sensitive to the combined effect moisture soldering heat
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Summary
Climate;Materials handling;Damp-heat tests;Environment (working);Environmental testing;Packaging;Mechanical testing;Surface mounting devices;Electronic equipment and components;Integrated circuits;Soldering;Labelling (process);Thermal testing;Transportation;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/13/2018 |
| Page Count | 39 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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