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BS EN 60749-20-1:2009
Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling shipping of surface-mount devices sensitive to the combined effect moisture soldering heat
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Summary
Mechanical testing;Transportation;Semiconductor devices;Electronic equipment and components;Damp-heat tests;Integrated circuits;Climate;Environmental testing;Labelling (process);Soldering;Environment (working);Thermal testing;Surface mounting devices;Materials handling;Packaging
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/31/2009 |
| Page Count | 38 |
| Themes | Packaging |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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