Superseded
Standard
Historical
BS EN 60749-20:2009
Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect moisture soldering heat
Preview
Summary
Plastics;Climate;Thermal testing;Encapsulated;Surface mounting devices;Damp-heat tests;Environmental testing;Electronic equipment and components;Semiconductor devices;Integrated circuits;Soldering;Solderability testing;Mechanical testing
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/31/2010 |
| Cancellation Date | 10/14/2020 |
| Page Count | 32 |
| Themes | Mechanical testing |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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