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BS EN IEC 60749-10:2022
Semiconductor devices. Mechanical and climatic test methods shock. device subassembly
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Summary
Integrated circuits;Destructive testing;Electronic equipment and components;Mechanical shock;Environmental testing;Climate;Mechanical testing;Impact testing;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 08/16/2022 |
| Page Count | 16 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
Replaces
17/09/2002
Superseded
Historical
Previous versions
16/08/2022
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