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BS EN IEC 60749-22-2:2026
Semiconductor devices — Mechanical and climatic test methods Bond strength — Wire bond shear
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| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/21/2026 |
| Page Count | 40 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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04/07/2003
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21/01/2026
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