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BS EN IEC 60749-37:2022
Semiconductor devices. Mechanical and climatic test methods Board level drop method using an accelerometer
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Summary
Semiconductor devices;Semiconductors;Electronic components;Printed-circuit boards;Electrical failure;Failure analysis;Testing;Reports;Accelerometers
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 11/22/2022 |
| Page Count | 28 |
| Themes | Accelerometers |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
Replaces
30/05/2008
Superseded
Historical