DIN EN 60068-2-58:2005-03
Superseded Standard
Historical

DIN EN 60068-2-58:2005-03

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004.
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Summary

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder allays containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys.

Notes

DIN EN 60068-2-58 (1999-10) remains valid alongside this standard until 2007-09-01.*A transition period, as set out in DIN EN 60068-2-58 (2016-01), exists until 2018-05-01.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 03/01/2005
Page Count 27
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ISBN ---
Weight (in grams) ---
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