Superseded
Draft standard
Historical
DIN EN 60068-2-58:2011-07
Environmental testing - Part 2-58: Test - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 91/963/CD:2011)
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Summary
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
Notes
Prévu pour remplacer DIN EN 60068-2-58 (2005-03).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2011 |
| Page Count | 54 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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