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DIN EN 60749-21:2012-01
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011.
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Summary
This part of DIN EN 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
Notes
DIN EN 60749-21 (2005-06) remains valid alongside this standard until 2014-05-12.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2012 |
| Page Count | 23 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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