DIN EN 61189-3-719:2014-04
Superseded Draft standard
Historical

DIN EN 61189-3-719:2014-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling (IEC 91/1152/CD:2013)
Most recent standard

Summary

The purpose of this test is to monitor the resistance of single plated-through holes (PTHs) in printed boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling, which results in thermo-mechanical fatigue of PTHs.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 04/01/2014
Cancellation Date 12/01/2016
Page Count 21
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ISBN ---
Weight (in grams) ---
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