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DIN EN 61189-3-719:2016-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
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Summary
The purpose of this test is to monitor the resistance of single plated-through holes (PTHs) in printed boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling, which results in thermo-mechanical fatigue of PTHs.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 12/01/2016 |
| Page Count | 13 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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