Superseded Draft standard
Historical

DIN EN 61189-5-4:2013-07

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire (IEC 91/1072/CD:2012)

Summary

IEC 61189 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture.

Notes

Prévu pour remplacer DIN EN 61189-5 (2007-05, t).

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 07/01/2013
Cancellation Date 11/01/2015
Page Count 30
EAN ---
ISBN ---
Weight (in grams) ---
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