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DIN EN 61189-5-4:2015-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015.
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Summary
IEC 61189 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture.
Notes
DIN EN 61189-5 (2007-05) remains valid alongside this standard until 2018-02-12.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 11/01/2015 |
| Page Count | 25 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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