Superseded
Standard
Historical
DIN EN 61190-1-3:2011-04
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010.
Preview
Summary
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.
Notes
DIN EN 61190-1-3 (2007-11) remains valid alongside this standard until 2013-09-01.*A transition period, as set out in DIN EN IEC 61190-1-3 (2018-09), exists until 2021-01-17.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 04/01/2011 |
| Cancellation Date | 09/01/2018 |
| Page Count | 41 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
01/05/2015
Superseded
Historical
01/04/2011
Superseded
Historical
