Superseded
Draft standard
Historical
DIN EN 61191-3:2016-01
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)
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Summary
This part of IEC 61191 prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Notes
Prévu pour remplacer DIN EN 61191-3 (1999-06).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2016 |
| Cancellation Date | 05/01/2018 |
| Page Count | 32 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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