Active
Standard
Most Recent
DIN EN 61191-3:2018-05
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017.
Preview
Summary
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Notes
DIN EN 61191-3 (1999-06) remains valid alongside this standard until 2020-07-04.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 05/01/2018 |
| Page Count | 21 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
