DIN EN 62047-16:2012-11
Superseded Draft standard
Historical

DIN EN 62047-16:2012-11

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 47F/125/CD:2012)
Most recent standard

Summary

This part of IEC 62047 specifies the test methods to measure the residual stresses of thin films in MEMS by wafer curvature and cantilever beam deflection methods. The films should be deposited onto a substrate of known mechanical properties of Young's modulus and Poisson's ratio.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 11/01/2012
Cancellation Date 12/01/2015
Page Count 18
EAN ---
ISBN ---
Weight (in grams) ---
No products.

Previous versions

Contact us