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DIN EN 62047-16:2015-12
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
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Summary
This part of IEC 62047 specifies the test methods to measure the residual stresses of thin films in MEMS by wafer curvature and cantilever beam deflection methods. The films should be deposited onto a substrate of known mechanical properties of Young´s modulus and Poisson´s ratio.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 12/01/2015 |
| Page Count | 13 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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