DIN EN 62047-25:2014-05
Superseded Draft standard
Historical

DIN EN 62047-25:2014-05

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)
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Summary

This part of DIN EN 62047 specifies the on-line testing method to measure the bonding strength of micro area which is fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS). This part is applicable to the on-line pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 05/01/2014
Cancellation Date 04/01/2017
Page Count 38
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ISBN ---
Weight (in grams) ---
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