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DIN EN 62047-25:2017-04
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
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Summary
This part of DIN EN 62047 specifies the on-line testing method to measure the bonding strength of micro area which is fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS). This part is applicable to the on-line pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 04/01/2017 |
| Page Count | 23 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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