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DIN EN 62137-4:2013-01
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 91/1056/CD:2012)
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Summary
This part of IEC 62137 specifies the test method to evaluate for solder joint durability of area array type packages against thermo-mechanical stress which are applied to solder joints while they are mounted on the printed wiring board.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2013 |
| Cancellation Date | 07/01/2015 |
| Page Count | 73 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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