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DIN EN 62137-4:2015-07
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015.
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Summary
This part of IEC 62137 specifies the test method to evaluate for solder joint durability of area array type packages against thermo-mechanical stress which are applied to solder joints while they are mounted on the printed wiring board.
Notes
DIN EN 62137 (2005-04) remains valid alongside this standard until 2017-11-13.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2015 |
| Page Count | 44 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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