IEC 60191-6-18:2010/COR2:2010
Active Standard Corrigendum
Most Recent

IEC 60191-6-18:2010/COR2:2010

IEC 60191-6-18:2010/COR2:2010 Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Base standard
No description.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 07/28/2010
Edition 1.0
Page Count 1
EAN ---
ISBN ---
Weight (in grams) ---

Modifies

Previous versions

Contact us