IEC 60191-6-18:2010
Active , Modified Standard
Most Recent

IEC 60191-6-18:2010

IEC 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Base standard
Most recent standard

Summary

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 01/07/2010
Edition 1.0
Page Count 40
EAN ---
ISBN ---
Weight (in grams) ---
No products.

Previous versions

Contact us