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IEC 60749-19:2003/AMD1:2010
IEC 60749-19:2003/AMD1:2010 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 07/28/2010 |
| Edition | 1.0 |
| Page Count | 4 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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