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IEC 60749-19:2003
IEC 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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Summary
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 02/13/2003 |
| Edition | 1.0 |
| Page Count | 11 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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13/02/2003
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