SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
€61.00
IEC 822 VSB. PARALLEL SUB-SYSTEM BUS OF THE IEC 821 VMEBUS.
€157.00
Binary floating-point arithmetic for microprocessor systems
€62.00
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
€28.00
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
€35.00
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
€50.00
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
€59.00
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
€47.00
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
€60.00
Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
Semiconductor devices - Mechanical and climatic test methods -- Part 33: Accelerated moisture resistance - Unbiased autoclave
€40.00
