Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
€35.00
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
€47.00
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
€50.00
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
€28.00
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
€69.00
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
€40.00
LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED MICROCIRCUITS.
€91.00
MICROPOCESSOR SYSTEM BUS I 8-BIT AND 16 BIT DATA. PART 3: MECHANICAL AND PIN DESCRIPTIONS FOR THE EUROCARD CONFIGURATION WITH PIN AND SOCKET (INDIRECT) CONNECTORS.
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
