31.180 : Printed circuits and boards

DIN EN 123800:1997-10

DIN EN 123800:1997-10

Withdrawn Most Recent

Sectional specification - Flexible multilayer printed boards with through connection; German version EN 123800:1996

€116.64

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DIN EN 61249-7-1:1996-01

DIN EN 61249-7-1:1996-01

Active Most Recent

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials; section 1: Copper/Invar/copper (IEC 61249-7-1:1995); German version EN 61249-7-1:1995

€41.78

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DIN EN 123000/A1:1996-05

DIN EN 123000/A1:1996-05

Withdrawn Most Recent

Generic specification: Printed boards; German version EN 123000:1992/A1:1995

€34.30

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DIN EN 123100/A1:1996-05

DIN EN 123100/A1:1996-05

Withdrawn Most Recent

Sectional specification: Single and double sided printed boards with plain holes; German version EN 123100:1992/A1:1995

€34.30

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DIN EN 123200/A1:1996-05

DIN EN 123200/A1:1996-05

Withdrawn Most Recent

Sectional specification: Single and double sided printed boards with plated-through holes; German version EN 123200:1992/A1:1995

€34.30

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DIN EN 123300/A1:1996-05

DIN EN 123300/A1:1996-05

Withdrawn Most Recent

Sectional specification: Multilayer printed boards; German version EN 123300:1992/A1:1995

€34.30

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DIN EN 123400/A2:1996-05

DIN EN 123400/A2:1996-05

Withdrawn Most Recent

Sectional specification: Flexible printed boards without through connections; German version EN 123400:1992/A2:1995

€34.30

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DIN EN 123500/A2:1996-05

DIN EN 123500/A2:1996-05

Withdrawn Most Recent

Sectional specification: Flexible printed boards with through connections; German version EN 123500:1992/A2:1995

€34.30

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DIN EN 61249-5-1:1996-06

DIN EN 61249-5-1:1996-06

Active Most Recent

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996

€56.17

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DIN EN 60097:1993-09

DIN EN 60097:1993-09

Withdrawn Most Recent

Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993

€41.78

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DIN IEC 60249-3-3:1994-06

DIN IEC 60249-3-3:1994-06

Active Most Recent

Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991

€63.27

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DIN EN 61188-5-6:2003-10

DIN EN 61188-5-6:2003-10

Active Most Recent

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003

€98.32

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DIN EN 62326-15:2012-01

DIN EN 62326-15:2012-01

Superseded Historical

Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages (IEC 91/995/CD:2011)

€105.42

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DIN EN 61189-3-913:2012-01

DIN EN 61189-3-913:2012-01

Superseded Historical

Test methods for electronic circuit board for high-brightness LEDs (IEC 91/1003/CD:2011)

€56.17

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DIN EN 62326-20:2012-02

DIN EN 62326-20:2012-02

Superseded Historical

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs (IEC 91/1007/CD:2011)

€140.00

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