Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/1276/CD:2015)
€150.65
Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015); German version EN 62878-1-1:2015
€162.06
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
€111.40
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 91/1285/CD:2015)
€116.64
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)
€105.42
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 91/1290/CD:2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards (IEC 91/1307/CD:2015)
Space product assurance - Design rules for printed circuit boards; English version FprEN 16602-70-12:2016
€315.42
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 91/1319/CD:2015)
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning (IEC 91/1453/CD:2017)
€48.79
Space product assurance - Qualification and Procurement of printed circuit boards; English version prEN 16602-70-60:2017
€423.74
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017
Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017.
€122.34
