IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
€101.00
IEEE Standard for Test Access Port and Boundary-Scan Architecture
€310.00
IEEE Standard for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components
€103.00
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019
€140.00
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
€0.00
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
€156.00
Matériaux de base pour circuits imprimés - Partie 2 : spécifications - Spécification n° 18 : feuille de stratifié en tissu de verre époxyde avec bismaléimide/triazine recouverte de cuivre, d'inflammabilité définie (essai de combustion verticale)
€56.33
Connecteurs sous assurance de la qualité, pour utilisation dans le cadre d'applications analogiques en courant continu et à basse fréquence et dans le cadre d'applications numériques utilisant des débits élevés pour le transfert des données - Partie 4 : connecteurs pour cartes imprimées. Section 101 : spécification particulière pour modules de connecteurs en deux parties pour cartes imprimées et fonds de panier au pas de base de 2,00 mm selon la IEC 60917.
€179.00
Composants électroniques - Système CENELEC d'assurance de la qualité - Cartes imprimées - Méthodes d'essai - Spécification de base
€91.00
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (IEC 91/1749/CD:2021); Text in German and English
€91.03
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021); German version EN IEC 61189-5-301:2021
€128.22
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:2021); German version EN IEC 61189-5-501:2021
€111.40
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021
€84.58
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021.
€122.34
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021); German version EN IEC 61189-5-601:2021
