Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
€69.91
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
€116.64
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German version EN IEC 61189-2-807:2021
€77.20
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022
€98.32
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 91/1637/CDV:2020); German and English version prEN IEC 61188-6-2:2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020); German version EN IEC 61189-5-504:2020
€111.40
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
€105.42
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
€63.27
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023); German version EN IEC 61249-2-51:2023
IEEE Standard for Space Applications Module, Extended Height Format E Form Factor
€149.00
IEEE Standard Test Access Port and Boundary-Scan Architecture
