Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-14:2009); German version EN 61249-4-14:2009
€91.03
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-16:2009); German version EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-15:2009); German version EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009); German version EN 61249-4-17:2009
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009); German version EN 61188-7:2009.
€105.42
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010
€150.65
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-41:2010); German version EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-42:2010); German version EN 61249-2-42:2010
Composants électroniques - Cartes imprimées - Caractéristiques et contrôle de réception d'un cliché de production.
€58.00
Space product assurance - Design rules for printed circuit boards
€205.00
Space product assurance - Procurement of printed circuit boards
€50.00
Space product assurance - Qualification of printed circuit boards
Space product assurance - Qualification and Procurement of printed circuit boards
IEC 62878-2-603:2025 Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
€93.00
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 3-6: Collection de spécifications intermédiaires pour matériaux de base non renforcés, métallisés et non métallisés - Feuilles stratifiées en PTFE avec charges d'inflammabilité (essai de combustion verticale), plaquées cuivre
€87.00
